PRODUCT

 

'Connect HITS'


引领全球半导体/显示设备产业的跨国企业

Substrate Split & Merge



M/Z TO M/Z Substrate Split & Merge System



System that split Substrate into a lot of M/Z and merge Substrate into its original M/Z after finishing certain process

to maximize production efficiency,





  • Applicable to max. 100 x 300 Substrate by auto conversion
  • Thin Substrate Damage Free
  • 3-layer High Speed Gripping Feeder
  • High Speed Split & Merge Function
  • Loader/Unloader Stacker accommodates Max. 20ea M/Z
  • Composition : M/Z Loading Stacker, Pusher & Gripper Transfer, M/Z Unloading Stacker