PRODUCT

 

'Connect HITS'


引领全球半导体/显示设备产业的跨国企业

IR Crack



IR Crack Inspection System



System that inspects a crack, chipping, etc. on pattern side of Flip chip and provides mapping on detected NG

by NIR/SWIR camera





  • Applicable to 74, 95mm FCBGA Substrate, FCCSP, FCSiP
  • Customized by Substrate, JIG, Boat
  • Customized by NIR or SWIR camera
  • Application of Deep Learning Algorithm to reduce overkill
  • Mapping & Review Function for verification on detected NG
  • Composition : M/Z Loading, Barcode Scan, Guide Rail, Transfer,
  • Vacuum Table, Vision Inspection, M/Z Unloading