KOR
ENGPRODUCTS
VISION INSPECTION SYSTEM
W/B, D/A
After Wire Bonding Process, System that inspects the external appearance of Ball/Wire and Stitch
- Applicable to FCBGA Substrate
- Deep Learning Algorithm, Review Function for verification
- 29M High Resolution camera
- Accuracy : 1.8um
- Provide various statistical data by NG type
- Inspection
- Wire connecting status, Stitch, Ball Attachment Status
- Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP,
- Vibration free super precision state, Porous Chuck Table,3D Vision Inspection
System that measures bonding path of wire after wire bonding process
- Possible to measure loop of stack device
- Measurement Repeatability : ±1um
- Excellent Expandability on Measurement Area
- Dual Vision Inspection Lane for 2D & 3D
- Deep Learning Algorithm, Review Function for verification
- Inspection Item
- 2D W/B : Ball Lifted, Size, Placement, Off center, Broken wire, wire to wire distance, etc.
- 2D D/A : Chip crack, Die position(No die, Die O/T),Pad Abnormal(Probe Mark), Film Shift
- Common, Sub Defect, Die Scratch
- 3D : Loop & Edge Height, Sub Height, Die Height
- Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP,
- Dual Vibration free super precision state, Porous Chuck Table,
- 2D Vision Inspection, 3D Vision Inspection
After Wire Bonding Process, System that inspects the external appearance of Ball/Wire and Stitch
- Applicable to FCBGA Substrate
- Deep Learning Algorithm, Review Function for verification
- 29M High Resolution camera
- Accuracy : 1.8um
- Provide various statistical data by NG type
- Inspection
- Wire connecting status, Stitch, Ball Attachment Status
- Composition : Magazine Loading/Unloading, Buffer Rail, Gripper PnP,
- Vibration free super precision state, Porous Chuck Table, 3D Vision Inspection
