PRODUCT

 

'Connect HITS'


引领全球半导体/显示设备产业的跨国企业

Mold



Mold Inspection System



System that inspects the external appearance of Mold





  • Applicable to FCBGA Substrate
  • Provide various statistical data by NG type
  • Flying High Speed Inspection
  • View function to observe and measure precisely
  • (Detail observation up to 1Pixel)
  • Accuracy : Over 20um
  • Inspection Item
  • Pin-Hole, Incomplete, S/C, Exposure, FM, etc.
  • Composition : M/Z Loading, Transfer Rail, Vision Inspection, M/Z Unloading

Mold Side Thickness & Surface Inspection System



System that inspects the lateral appearance of Semiconductor PKG Mold





  • Provide various statistical data by NG type
  • PKG Alignment by Align Vision (Resolution : 26um/pixel)
  • Inspection Resolution : 2um
  • Accuracy : 5um
  • Inspection Item
  • Thickness, Crack, Void by 3-point measurement
  • Composition : Tray Loading, PKG PnP, Alignment Vision Inspection,
  • Vision Inspection, Tray Unloading